Everwide JC812-2 Epoxy for SMT Devices Bonding
JC812-2 is a one component epoxy that is designed for fast curing at low temperature. This resin has high viscosity and thixotropy. The reactivity of this product is good at the temperature higher than 90°C. This product can be used in the printing and the dispensing process without wire drawing and collapse. The hardening surface will not exhibit a surface oiliness. The cured product exhibits good adhesive strength, electrical insulation properties, excellent chemical resistance and solvent resistance. Stable adhesive strength can be obtained with a variety of SMT.
- This product is solvent-free, non-volatile, system.
- This resin exhibits high viscosity and excellent thixotropy. This product can be also controlled flow and have sag resistance.
- This product offers excellent retention of electrical insulation properties under high humidity conditions.
- This resin has high thixotropic properties which can keep the shape and it will not slump after curing.
- This product complies to the 2011/65/EU RoHS regulations.
Color: Red
