Everwide JD100-5 Epoxy for Underfill
JD100-5 is one component epoxy adhesive for the application of rework and electronic devices. Cured product is easy to operate and suited for various applications of electronic components, such as casting and sealing. This resin can be fast cured at high temperature, is able to reduce the working time and increase the efficiency at the same time. This product develops tough, strong, structural bonds which provide excellent shear, peel and impact strength. The durability of this resin is very high levels and this resin can pass many environmental test experiments. This product is well suited for flip-chip underfill packaging process, and it can quickly fill the gap between the wafer complete package.
- This product is solvent-free, non-volatile, system and has no volative materials and will not release any toxic volatilizations.
- The hardening surface will not exhibit a surface oiliness and poor gloss.
- This product has low shrinkage.
- The reactivity of this product is good at the temperature higher than 150°C.
- Cured product is effective against moisture and water.
- This product complies to the 2011/65/EU RoHS regulations.
- This product complies to chlorine < 900ppm, bromine < 900ppm, chlorine + bromine < 1500ppm.
Color: Black
