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Everwide KA007 2-part Room Temperature Curing Thermal Conductivity Adhesive

Everwide KA007 2-part Room Temperature Curing Thermal Conductivity Adhesive

KA007 thermally conductive room temperature curing adhesive is designed to bond electronic components to heat sinks with a controllable gap. Low shrinkage and excellent thermal conductivity. It can quickly bond to most metals, ceramics, and glass without surface treatment. Excellent shear strength and good impact resistance and durability.
    1. This product exhibits good handling property after mixing.
    2. It can be cured at room temperature or heated (60°C/30 min).
    3. After the product is mixed, it has good fluidity and workability, and the surface gloss after curing is good.
    4. No solvent formula, low odor characteristics, fully comply with environmental protection requirements.
    5. Thermal conductivity is 0.8 W/mK.
    6. Excellent chemical resistance / water resistance.
    7. This product complies to the 2011/65/EU RoHS regulations.
Color: Gray to White
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